We assist local Australian businesses and IC design teams in connecting with OSAT (Outsourced OSAT) resources.
From clarifying requirements, document and quality specifications to business communication, the process is advanced and tracked in a project-based manner.
Facilitate communication using the Australian time zone and local business language to shorten travel time.
Translate engineering requirements into an executable packaging and testing process using RFQ input materials.
ISO/IATF consultantExamine the packaging and testing process from different angles to reduce the technology introduction gap.
Can be used in conjunction with NDA/MSA pre-processing and information exchange boundaries
Assist in optimizing OSAT packaging strategies
Semiconductor: A turnkey packaging and test services provider for semiconductor packaging and testing (OSAT), with many years of industry experience and a complete service portfolio.
- Global footprint: Production sites are located in Malaysia, China and other places to support mass production and diversified product lines.
- Diverse OSAT packaging combinations: Packaging/testing combinations cover QFN/DFN (MLP), SiP, Flip Chip, LGA/BGA, MEMS & Sensors, Cu Clip, etc.
- Wide range of applications: Automotive / Industrial / Consumer & Communications / PC & Notebook / Power Management (including SiC/GaN)
- Automotive Certification: Possesses packaging and testing processes and reliability testing capabilities that support automotive specifications.